Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev
Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering
Electronics Forum | Mon Jun 05 12:30:24 EDT 2017 | deanm
Mike, The dispensable solder paste is ordered separately from the printed paste because it has a higher flux content. I would not feel comfortable mixing liquid flux into the printable paste. Ask your paste vendor if they have a dispensable version.
Electronics Forum | Tue Mar 19 08:18:36 EDT 2019 | sujay
ParsonAdhesive is one of the best constructors of a spacious range of high-grade anaerobic adhesives for a variety of Industrial Adhesives applications. ParsonAdhesive are provide these anaerobic adhesives and Industrial Adhesive to a spacious varie
Electronics Forum | Thu Aug 29 20:15:26 EDT 2002 | davef
That you are getting BIG gobs of solder on the pads indicates that your print / paste process is probably OK. Sounds like someone did something bad to the OSP. Tell us about: * Supplier and brand of OSP that your board fabricator used. * Number of
Electronics Forum | Wed Nov 10 16:19:51 EST 2010 | davef
The 5 thou standoff of your SOIC is probably the minimum. We wouldn't be surprised to see 10 thou. With this, you could have maybe a 6 thou gap between printed solder paste and the bottom of the heat slug. So, you're expecting the rabbit ears of p
Electronics Forum | Thu Jul 22 21:48:21 EDT 1999 | kyung sam park
Does anyone have any experiences with bga reballing. When I had reworked failed bga part with new part It was good. So I tried to reball bga detached but failed . I guess the cause of fail is thermal shock. IS IT OK TO REBALL BGA PARTS DETACHED ?
Electronics Forum | Mon Jul 26 15:09:31 EDT 1999 | APE South
| Does anyone have any experiences with bga reballing. | When I had reworked failed bga part with new part It was good. | So I tried to reball bga detached but failed . | I guess the cause of fail is thermal shock. | IS IT OK TO REBALL BGA PARTS
Electronics Forum | Mon Sep 21 08:14:14 EDT 1998 | Steve Gregory
| Hello: | I would like to know what causes tombstombing and how can it be prevented? | Thx. | Nichol Hi Nichol! A tombstone happens when solder doesn't wet equally on both terminations during reflow...now why that happens can be found by looking at
Electronics Forum | Thu Nov 18 10:56:16 EST 1999 | Dave F
Jacky: There�re major four factors that affect the reliability of a solder connection. 1 Design of the connection including the shape and height of the lead and the type and amount of solder. 2 Dissolution of base metals into the solder connection.
Electronics Forum | Thu Nov 11 11:11:18 EST 2004 | clampron
D.B., You are justified in your concern over the last requirement. I have been imposed by a customer with the same hand solder/rework requirements. It seems the biggest concern is thermally shocking ceramic chips. You are much less likely to do this
